Contact Plating  

Tin

Mount  

Surface Mount

Mounting Type  

Surface Mount

Package / Case  

8-SOIC (0.154, 3.90mm Width)

Number of Pins  

8

Transistor Element Material  

SILICON

Current - Continuous Drain (Id) @ 25℃  

27A Ta

Drive Voltage (Max Rds On, Min Rds On)  

2.5V 4.5V

Number of Elements  

1

Power Dissipation (Max)  

2.5W Ta

Turn Off Delay Time  

320 ns

Operating Temperature  

-55°C~150°C TJ

Packaging  

Tube

Series  

HEXFET®

Published  

2004

Part Status  

Discontinued

Moisture Sensitivity Level (MSL)  

1 (Unlimited)

Number of Terminations  

8

ECCN Code  

EAR99

Terminal Position  

DUAL

Terminal Form  

GULL WING

Configuration  

SINGLE WITH BUILT-IN DIODE

Operating Mode  

ENHANCEMENT MODE

Power Dissipation  

2.5W

Turn On Delay Time  

29 ns

FET Type  

N-Channel

Transistor Application  

SWITCHING

Rds On (Max) @ Id, Vgs  

2.45m Ω @ 27A, 4.5V

Vgs(th) (Max) @ Id  

1.1V @ 100μA

Input Capacitance (Ciss) (Max) @ Vds  

8555pF @ 16V

Gate Charge (Qg) (Max) @ Vgs  

195nC @ 4.5V

Rise Time  

100ns

Vgs (Max)  

±12V

Fall Time (Typ)  

265 ns

Continuous Drain Current (ID)  

27A

Threshold Voltage  

1.1V

Gate to Source Voltage (Vgs)  

12V

Drain-source On Resistance-Max  

0.00245Ohm

Drain to Source Breakdown Voltage  

20V

Recovery Time  

120 ns

Height  

1.4986mm

Length  

4.9784mm

Width  

3.9878mm

REACH SVHC  

No SVHC

Radiation Hardening  

No

RoHS Status  

ROHS3 Compliant